Electrical Hardware Packaging Engineer

Fort Worth, TX Fort Worth TX 76196

Date : Nov-16-24

Electrical Hardware Packaging Engineer

Fort Worth, TX

Nov-16-24

Work Authorization

US Citizen
GC
H1B
GC EAD

Preferred Employment

Corp-Corp
W2-Permanent
W2-Contract
1099-Contract
Contract to Hire

Job Details

Experience

:

Midlevel

Rate/Salary ($)

:

Market

Duration

:

12 months

Sp. Area

:

C, C++, Middleware, Embedded

Sp. Skills

:

x-Other

Consulting / Contract

Direct Client Requirement

Required Skills :

3DX, CATIA V5, Catia V6, connectors, DO-160, electronic hardware, housings, metallic, MIL-STD-461/464, MIL-STD-810, packaging, PCBs

Preferred Skills :

Domain :

IT/Software

Work Authorization

US Citizen
GC
GC EAD
H1B

Preferred Employment

Corp-Corp
W2-Permanent
W2-Contract
1099-Contract
Contract to Hire

Job Details

Experience

:

Midlevel

Rate/Salary ($)

:

Market

Duration

:

12 months

Sp. Area

:

C, C++, Middleware, Embedded

Sp. Skills

:

x-Other

Consulting / Contract

Direct Client Requirement

Required Skills :

3DX, CATIA V5, Catia V6, connectors, DO-160, electronic hardware, housings, metallic, MIL-STD-461/464, MIL-STD-810, packaging, PCBs

Preferred Skills :

Domain : IT/Software

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Accord Tecnologies.Inc
New York, NY
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Job Description :

Electrical Hardware Packaging Engineer
Location: Fort worth, TX
Duration: long term
Visa: US/GC
******Onsite Only ******
We are seeking an experienced electrical hardware packaging engineer.
This candidate will be responsible for coordinating space reservations, physical and electrical interfaces, detailed design of metallic and other packaging and installation details, coordination with other design/analysis disciplines, coordination with procurement and suppliers, and ultimately creating assembly and installation instructions for the final product.
******Requirements:
*****Must have BSME Bachelor of Science Mechanical Engineering
*****Must CATIA V5 and/or CATIA V6 and/or 3DX experience (at least 5 years)
*****Recent electronic hardware (PCBs, connectors, housings, metallic and other details) packaging experience
***** Must have ability to perform both static and structural analysis for electronics packaging
***** Must have ability to perform thermal analysis for electronics packaging
*****Must be familiar with aerospace standards (MIL-STD-810, MIL-STD-461/464, DO-160)
*****Must have ability to work on US government projects

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